Atividade

● Feature
Viewing angle:120 deg
The materials of the LED dice is InGaN
5.60mm×3.00mm×0.77mm
RoHS compliant lead-free soldering compatible
● Package Outline
Unit:mm
NOTES:
1. All dimensions are in millimeters;
2. Tolerances are±0.1mm unless otherwise noted.

●Absolute maximum ratings Ta=25±3℃
Parameter Symbol Value Unit
Power dissipation Pd 0.5 W
Forward current If 150 mA
Reverse voltage Vr 5 V
Operating temperature range Topr -40~+85 ℃
Storage temperaturer range Tstg -40~+100 ℃
Pulse Forward Current Ifp 200 mA
Electrostatic Discharge ESD 2000(HBM) V
●Electro-optical characteristics Ta=25±3℃
Parameter Test Condition Symbol Value Unit
Min. Typ. Max.
Forward voltageIf=150 mAVf6.0–7.0V
Luminous intensity
If=150 mAΦ100–120Lm
Viewing angle 50% IvIf=150 mA2θ 1/2–120–Deg
Reverse currentVr=5VIr—-10μA
ColorTemperatureIf=150 mATC–4000–K
Chromaticity CIE
If=150 mACIE Color different≤5
CRIIf=150 mARa≥80
NOTES:
1.Luminous Flux measurement tolerance:±10%
2.Forward Voltage measurement tolerance:±0.1V
3.Color Temperature measurement tolerance:x,y±0.01
4.CRI measurement tolerance:±2
● Intensity Bin Limit (IF = 150 mA)
Bin code Flux(lm) for reference
Min Max
190LM100LM
2100LM110LM
3110LM120LM
4120LM130LM
5130LM140LM
6—-
7—-
8—-
9—-
● VF Bin Limit (IF = 150 mA)
Bin code Min.(V) Max.(V)
16.07.0
2—-
3—-
4—-
5—-
● Chromaticity CIE
● Color Bin Limit (IF =150 mA)
●Requirements for application and reflow soldering
Reflow Soldering
Pre-heat120~160℃
Pro-heat time120 seconds Max.
Peak temperature245℃ Max.
Soldering time10 seconds Max.
ConditionRefer to Temperature-profile
After reflow soldering rapid cooling should be avoided
Temperature-profile(Surface of circuit board)
Use the following conditions shown in the figure.

1. Reflow soldering should not be done more than two times
2.When soldering,do not put stress on the LEDs during heating
●Handling Precautions
Compare to epoxy encapsulation that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more prone to damage by external mechanical force. As a result, Special handling precautions must be observed during assembling using silicone encapsulated LED product, Failure to comply might leads to damage and premature failure of the LED.

♦ Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or handle the silicone lens surface, it may damage the internal circuitry.
♦ Not suitable to operate in acidic environment, PH<7.

♦ LED operating environment and sulfur element composition cannot be over 25 PPM in the LED mating usage material.

When we need to use external glue for LEDs application products, please make sure that the external gluematches the LEDs packaging glue. Additionally ,as most of LEDs packaging glue is silica gel, and it has strong Oxygen permeability as well as strong moisture permeability; in order to prevent external material from getting into the inside of LEDs, which may cause the malfunction of LEDs, the single content of Bromine
element is required to be less than 225 PPM,the single content of Chlorine element is required to be less than225PPM,the total content of Bromine element and Chlorine element in the external glue of the applicationproducts is required to be less than 375 PPM.

♦ The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top ofpackage. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should betaken to avoid the strong pressure on the encapsulated part. So when using the picking up nozzle, the pressureon the silicone resin should be proper.

♦ Static electricity or surge voltage damages the LEDs. Damaged LEDs will show some unusual characteristicssuch as the lower forward voltage, or the not light at low current, even not light. All devices, equipment andmachinery must be properly grounded. At the same time, it is recommended that wrist bands oranti-electrostatic gloves, anti-electrostatic containers be used when dealing with the LEDs.

Storage
♦ Before opening the package, the LEDs should be kept at 30℃ or less and 60%RH or less. The LEDs shouldbe used within a year.

♦ After opening the package, the product should be stored at 30℃ or less and humidity less than 10% RH, andbe soldered within 24 H. It is recommended that the product be operated at the workshop condition of 30℃or less and humidity less than 60% RH. If unused LEDs remain, they should be stored in moisture proofpackages, such as sealed containers with packages of moisture absorbent material (silica gel). It is alsorecommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bagagain.
●Reliability
(1) TEST ITEMS AND RESULTS
TypeTest ItemRef.StandardTest ConditionsNoteNumber of Damaged
Environmental
SequenceResistance to Soldering Heat(Reflow Soldering)JESD22-B106Tsld=260℃，5sec2 times0/100
Temperature CycleJESD22-A104-40℃30min ↑↓5min
100℃ 30min100 cycle0/100
Thermal ShockJESD22-A106-40℃15min ↑↓5min
100℃ 15min100 cycle0/100
High Temperature StorageJESD22-A103Ta=100℃1000 hrs0/100
Low Temperature StorageJESD22-A119Ta=-40℃1000 hrs0/100
Power temperature CyclingJESD22-A105On 5min -40℃＞15min
↑↓ ↑↓＜15min
Off5min 100℃＞15min100 cycle0/100
Operation
SequenceLife TestJESD22-A108Ta=25℃
IF=150mA1000 hrs0/100
High Humidity Heat
Life TestJESD22-A10180℃RH=80%
IF=150mA1000 hrs0/100
(2) CRITERRIA FOR JUDGING　THE DAMAGE
ItemSymbolTest ConditionsCriteria for Judgement
Min.Max.
Forward VoltageVFIF=150mA–U.S.L*)×1.1
Reverse CurrentIRVR=5V–U.S.L*)×2.0
Luminous IntensityIVIF=150mAL.S.L**)×0.7
U.S.L.:Upper Standard Level L.S.L.:Lower Standard Level
●Packaging Specifications
Package Tape Specifications：(4000 pcs/Reel)
Dimensions of Tape(Unit:mm)
Company：
Patents：SMD LED 5630 price
website:http://www.smd-emc-led.com/smd-led/smd-led-5630/